2Piece Soldering Lugs Solder Piece Rework Pad Welding Point Repair for Phones IC Pad Touch BGA PCB Fingerprint Welding Plates
Inhouse product
Features:
1.Replace the tradional circling of jump wire to filled the missing solder joint ,restore to the original pad and without trace
2.The pads are reinforced with fixed pins and will never fall off
3.It adopts industrial-grade printed circuit board copper foil with a thickness of 30μm
4.Good flatness,which can prevent pseudo soldering effectively caused by unevenness
5.The connection joint with the circuit is firm ,and can fixed the green oil(UV curing solder mask ink)well
6.It saves time and effort and no need to circle during jumping wire so the repair efficiency is relatively high
7.The BGA bonding surface has saturation ,stable electrical performance ,good welding strength ,and it is not easy to drop off and unsoldering.
Applicable:
Applicable for dot-faded soldering pad with various shapes and models of soldering lug
Applicable for beauty the pad with seamless repairing
Use:
Effect After Repairing
Curling the wires to make jumper wires is no longer needed. After pads soldering, the double-layered motherboard can be installed to the testing fixture or recombined directly. Repair efficiency will be tremendously increased.
Note:
1.Pls check size carefully,
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