UPSIREN Thermal Putty U6 PRO For VGA GPU IC Processor Rapid Cooling Thermal Pad Replacement Heat Blocking Putty High Performance
Inhouse product
PRODUCT DESCRIPTION
U6-PRO is a high thermal performance, unique, fully cured thermal management solution for electronic assemblies, this material is not dry out. It has low viscosity for dispensing use application; this material have good tacky on the heat-sink can be used for application involving auto-dispensing equipment or stencil screen-printing. It’s ideal for rework and field repair situations. Compare with thermal pad this material is can fully fill the gap and good compression, cost saving. U6-PRO is RoHS compliant and halogen-free, offering extra reassurance in applications where hazardous substances are forbidden.
Applications
Automotive Electronic Control Units
Heat sink, Memory modules
LED Lighting, LCD-TV
Military Electronics
Power Supplies
Telecom services,
Wireless instruments
Automotive control services
Features and Benefits
High thermal conductivity
Natural tacky & Low contact resistance
Full-cured & No oil-bleeding
High compression
Suit auto-dispensing equipment
Meets Rohs specifications
Features and Benefits
High thermal conductivity
Natural tacky & Low contact resistance
Full-cured & No oil-bleeding
High compression
Suit auto-dispensing equipment
Meets Rohs specifications
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