24K Explosion Proof Gold-Pated Foil Gasket 3 Bottles Qianli iAtlas Easy To Tin In Reballing Precise BGA Mainboard Repair Shim

Qianli iAtlas Solder Explosion Proof 24K Gold-plated Foil, Phone Motherboard Chips Precise Electronics Hardware Solder Repair,About 1650 Pcs

PACKLIST :

Fullset : 0.08mm *1, 0.10mm*1, 0.12mm*1

0.08mm: 0.08mm *3
0.10mm: 0.10mm *3
0.12mm: 0.12mm *3

About 1650 pieces in three boxes, and about 550 pieces in each box

1. iAtlas 24k

Solder Explosion Proof 24K Gold-plated Foil
Solder explosion when reballing,tin adhesion,avoid
pressing due to crooked motherboard

2. When repairing the motherboard and chips

Have you ever met these problems？
Solder explosion when reballing,avoid pressing due to crooked motherboard,high repair rate,etc

3. The motherboard repair secret that most masters are reluctant to tell.

Increase efficiency because time is money
Plated 24K pure gold,The motherboard repair secret that most masters are reluctant to tell.

24K gold plated outer layer: Excellent electrical performance

4. Breakthrouth Precise maintenance standard.

Improve working efficiency for master lower skill dependency for green bird

5. Small Size, Great Efficiency Backbone of the precise electronics hardware

During the repair process, take the required gold-plated foil out and place them at the relative support point.

6. Anti Solder explosion We are professional at it

Improve working efficiency for master increase success rate for green bird
1) Add the foil
Adding the foil will increase the reasonable gap between the motherboard and the tin paste, to avoid overflowing
2) Fearless to pressing
Slight deformation of motherboard, if supported by the foil, it can also be fit well'

7. Fit well and seamless ,More stable alignment,without the concern of motherboard slight deformation

Foil and tin paste = Steel and Cement

8. Easy to take Ready to Clamp and use

9. Only 4 simple steps to finish the adding of foil

1) Reballing with stencils
2) Use tweezers to take the foil out
3) Place the foil in the tin paste of the solder plate
4) Melt the tin pasted in the solder plate to fix the foil and use it in alignment

10. Wide Range of Applications,can be used on middle frames,chips and BGA

Applied to all electronic components required lamination

11. Genunie gold plated

All materials are controlled with rigid standards it is the guarantee of product quality
1) 24k Gold-plated process
2) Better anti-oxidation
3) Better conductivity
4) To achieve more stable solder explosion proof

12. Various kinds,different thickness,different weight

0.08mm
0.10mm
0.12mm