I2C Syn14 RELIFE RL-601T 18in1 Universal Motherboard Middle Layer Tin Planting Table for IPhone X-14 Pro Max Repair Steel Net
Relife RL-601T 18-in-1 Middle Layer Tin Planting BGA Reballing Platform Set for iPhone X to 14 Pro Max motherboard repair, RL-601T BGA reballing metal stencil motherboard middle frame planting tin reballing platform soldering / desoldering / reballing repair tool, Relife iPhone middle layer planting tin soldering fixture.
Features: 1. Middle layer tin planting platform set for iPhone X/XS/XS Max/11/ 11 Pro/11Pro Max/12/12 Mini/12 Pro/12Pro Max/13/13 Mini/13 Pro/13Pro Max/14/14 Plus/14 Pro/14Pro Max. 2. High-quality steel, round and square precise hole positions make the solder balls more rounded and prevent the mesh from jamming the solder balls. 3. Super magnetic force / Multi-model infinite extension base / Precise positioning and close fit. 4. Anti-drum, so that each solder ball is round and full, to meet the needs of various chips. 5. Comes with precise positioning, so it is more convenient to align the holes.